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HE860 Series, Half-Size PISA-Bus SBC/CPU Card w/Low-Power Fanless Embedded Via Eden 533MHz @ 133MHz CPU, Via Chipsets, WDT, RTC, (1) 168-Pin DIMM Slot, 3D SVGA, (opt) TMDS Panel Link Interface, 10/100 Mbps LAN Interface, AC97-3D Audio, DOC ISA 64mA High Drive Capacity

Quick Specs

Board Form Half-Size (7.5 x 5.0 in / 185 x 122 mm)
Bus Interface PISA
CPU Socket Embedded
Manufacturer COMMELL
System Chipset VIA PLE133T
Video (Display) Chipset VIA VT8601
Video (Display) Chipset Trident 3D/2D
Video (Display) Chipset VIA PLE133T
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Product Features

  • CPU Built-in 192 KB L1/L2 Cache Memory and MMX / 3DNow! Suppor
  • CompactFlash Interface for IDE-free Embedded Software Installation
  • Embedded VIA Eden Platform with 533 MHz CPU @ 133 MHz FSB Complete x86 Architecture with Ultra Low Power Consumption for Embedded, Low Power, Fan Free, Mobile Application
  • Advanced Embedded Computing Platform
  • Built-in 3D SVGA Controller with 8 MB Video Memory
  • All-in-one VGA, Audio, LAN Integration for Embedded Application
  • All-in-one Integrated Solution
  • Ultra-Low Power / Fan Free Solution
  • ISA 64mA High Drvie Capacity for Mulitple ISA-based Platform
  • Flexible PISA Form Factor with Multiple PCI/ISA Expansibility
  • 512 MB PC133 SDRAM on One 168-pin DIMM Slot

Full Product Specifications

Board Form Half-Size (7.5 x 5.0 in / 185 x 122 mm)
Bus Interface PISA
CPU Socket Embedded
Manufacturer COMMELL
Processor VIA Eden
Processor VIA C3
System Chipset VIA PLE133T
Video (Display) Chipset VIA VT8601
Video (Display) Chipset Trident 3D/2D
Video (Display) Chipset VIA PLE133T

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