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Commell HE-860 - Half-size SBC PISA Embedded VIA Eden 533 MHz CPU @ 133 MHz FSB, Integrated 3D SVGA, LAN, Audio and DOC Interfaces, ISA 64mA High Drive Capacity

Quick Specs

Board Form Half-Size (7.5 x 5.0 in / 185 x 122 mm)
Bus Interface ISA
Bus Interface PISA
CPU Socket Embedded
Manufacturer COMMELL
System Chipset VIA PLE133T
System Chipset VIA 8601T
Video (Display) Chipset VIA PLE133T
Video (Display) Chipset Trident 3D/2D
Video (Display) Chipset VIA VT8601
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Product Features

  • CPU Built-in 192 KB L1/L2 Cache Memory and MMX / 3DNow! Suppor
  • Flexible PISA Form Factor with Multiple PCI/ISA Expansibility
  • CompactFlash Interface for IDE-free Embedded Software Installation
  • 512 MB PC133 SDRAM on One 168-pin DIMM Slot
  • Embedded VIA Eden Platform with 533 MHz CPU @ 133 MHz FSB Complete x86 Architecture with Ultra Low Power Consumption for Embedded, Low Power, Fan Free, Mobile Application
  • ISA 64mA High Drvie Capacity for Mulitple ISA-based Platform
  • All-in-one VGA, Audio, LAN Integration for Embedded Application
  • Built-in 3D SVGA Controller with 8 MB Video Memory

Full Product Specifications

Board Form Half-Size (7.5 x 5.0 in / 185 x 122 mm)
Bus Interface ISA
Bus Interface PISA
CPU Socket Embedded
Manufacturer COMMELL
Processor VIA Eden
Processor VIA C3
System Chipset VIA PLE133T
System Chipset VIA 8601T
Video (Display) Chipset VIA PLE133T
Video (Display) Chipset Trident 3D/2D
Video (Display) Chipset VIA VT8601